Technology Capability

Layer Counts 2~56 Board Thickness Max:8.4mm Min:0.6mm Drill Size CNC:0.2mm Laser:4mil Aspect Ratio 16:1 Dimension Max:610mm×1100mm Line&Space Inner Layer: 0.5OZ—3mil/3mil 1OZ—3.5mil/3.5mil Outer Layer: 50um—4mil/3.5mil Impedance Tolerance ±10% Min Core Thickness 3mil Surface Finished HASL Immersion Gold Immersion Tin Immersion Silver Gold Finger Plating OSP Selective OSP & Immersion Gold Materials Common FR4 S1141 MTC-97 LDPP Middle Tg FR4 S1000 IT158 High Tg FR4 S1170 GA170 S1000-2 EM827 IT180 Modified FR4 MCL-BE-67 GXA-67N（PP） N4000 Rogers R4350 R4003 R4403（PP） Halogen Free GA-HFTL Tg170℃ GA-HFB(PP) Tg170℃ S1155 S0155(PP) PPO/PPE PCL-LD621/PCL-LDP-621 GETEK RCC LG-F-2000 S6018 PTFE TLC-32 RF-35 TLX N9000 25N/25FR Diclad Cuclad Isoclad SpeedBoardC